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Showing 793–804 of 20355 results
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AS 1099.2TA: 01/01/1973 Basic environmental testing procedures for electronics and telecommunications purposes, Part 2TA: Test Ta: Solderability
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AS 1099.2TA2: 12/31/1977 Basic environmental testing procedures for electronics and telecommunications purposes, Part 2TA2: Tests – Solderabiity of printed circuit boards and metal-clad base laminates
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AS 1099.2U: 12/31/1975 Basic environmental testing procedures for electronics and telecommunications purposes, Part 2U: Tests – Robustness of terminations
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AS 1099.2UA1: 08/01/1976 Basic environmental testing procedures for electrotechnology, Part 2UA1: Tests – Test Ua1 – Robustness of terminations – Tensile
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AS 1099.2UA2: 08/01/1976 Basic environmental testing procedures for electrotechnology, Part 2UA2: Tests – Test Ua2 – Robustness of terminations – Thrust
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AS 1099.2UB: 08/01/1976 Basic environmental testing procedures for electrotechnology, Part 2UB: Tests – Test Ub – Robustness of terminations – Bending
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AS 1099.2UC: 08/01/1976 Basic environmental testing procedures for electrotechnology, Part 2UC: Tests – Test Uc – Robustness of terminations – Torsion
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AS 1099.2UD: 08/01/1976 Basic environmental testing procedures for electrotechnology, Part 2UD: Tests – Test Ud – Robustness of terminations – Torque
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AS 1099.2Z AD: 12/31/1979 Basic environmental testing procedures for electrotechnology, Part 2ZAD: Tests – Test Z/AD – Composite temperature/humidity cyclic test
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AS 1099.2Z AM: 12/31/1979 Basic environmental testing procedures for electrotechnology, Part 2ZAM: Tests – Test Z/AM – Combined cold/low air pressure tests
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AS 1099.2Z BM: 12/31/1979 Basic environmental testing procedures for electrotechnology, Part 2ZBM: Tests – Test Z/BM – Combined dry heat/low air pressure tests
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AS 1099.3.1: 12/31/1979 Basic environmental testing procedures for electrotechnology, Part 3.1: Background information – Section 1 – Tests A and B – Cold and dry heat tests