AS ISO/IEC 18745.1:2024 identically adopts ISO/IEC 18745 1:2018, which provides a set of instructions for evaluation of MRPs which may incorporate contactless integrated circuits.
Table of contents
Header
About this publication
Preface
Foreword
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Abbreviated terms
5 Methodology
6 Guidance to the tester
6.1 Number of samples
6.2 Preparation
6.3 Sampling
6.4 Storage
7 Common method information
7.1 Default environment
7.2 Climatic conditions
7.3 Tolerances
7.4 Default MRP holder
8 Stress methods
8.1 Conditioning stress method
8.1.1 General
8.1.2 Input Parameters
8.1.3 Apparatus
8.1.3.1
8.1.4 Method
8.2 Thermal cycling stress method
8.2.1 General
8.2.2 Input parameters
8.2.3 Apparatus
8.2.3.1
8.2.3.2
8.2.4 Method
8.3 Storage temperature stress method
8.3.1 General
8.3.2 Input parameters
8.3.3 Apparatus
8.3.3.1
8.3.3.2
8.3.4 Method
8.4 Operational climate stress method
8.4.1 General
8.4.2 Input Parameters
8.4.3 Apparatus
8.4.3.1
8.4.3.2
8.4.4 Method
8.5 Impact stress method
8.5.1 General
8.5.2 Input parameters
8.5.3 Output parameters
8.5.4 Apparatus
8.5.4.1 Stamp
8.5.4.2 Stamp construction
8.5.4.3 Description of stamp parameters
8.5.5 Method
8.5.6 Alternate method
8.6 Book bend stress method (back pocket)
8.6.1 General
8.6.2 Input parameters
8.6.3 Output parameters
8.6.4 Apparatus
8.6.4.1
8.6.4.2
8.6.4.3
8.6.4.4
8.6.5 Method
8.7 Dynamic bend stress method
8.7.1 General
8.7.2 Input parameters
8.7.3 Output parameters
8.7.4 Apparatus
8.7.4.1
8.7.5 Calibration of movement method
8.7.6 Method
8.8 Torsion stress method
8.8.1 General
8.8.2 Input parameters
8.8.3 Output parameters
8.8.4 Apparatus
8.8.5 Calibration
8.8.6 Method
8.9 Sheet turning stress method
8.9.1 General
8.9.2 Input parameters
8.9.3 Output parameters
8.9.4 Apparatus
8.9.4.1
8.9.4.2
8.9.4.3
8.9.5 Method
8.9.6 Bending parameters
8.10 Sheet pull stress method
8.10.1 General
8.10.2 Input parameters
8.10.3 Output parameters
8.10.4 Apparatus
8.10.4.1
8.10.4.2
8.10.5 Method
8.11 Abrasion stress method
8.11.1 General
8.11.2 Input parameters
8.11.3 Output parameters
8.11.4 Apparatus
8.11.4.1
8.11.5 Method
8.12 Pen stress method
8.12.1 General
8.12.2 Input parameters
8.12.3 Output parameters
8.12.4 Apparatus
8.12.4.1
8.12.4.2
8.12.5 Method
8.13 Resistance to chemicals stress method
8.13.1 General
8.13.2 Input parameters
8.13.3 Output parameters
8.13.4 Apparatus
8.13.4.1
8.13.5 Short term contamination test
8.13.5.1 Short term reagents (list provided here for information only, defined in ISO/IEC 10373-1)
8.13.5.1.1
8.13.5.1.2
8.13.5.1.3
8.13.5.1.4
8.13.5.1.5
8.13.5.1.6
8.13.5.1.7
8.13.5.2 Short term contamination method
8.13.6 Long term contamination test
8.13.6.1 Long term reagents (list provided here for information only, defined in ISO/IEC 10373-1)