AS 1099.2EB-1971

$50.39

Basic environmental testing procedures for electrotechnology, Part 2EB: Tests — Bump

The object of this test is to determine the suitability of components and equipments for applications where they are subjected to prolonged bumping and/or to assess their structural integrity.

Content history

[Superseded]

Please select a variation to view its description.

Published

01/01/1971

Pages

4

Please select a variation to view its pdf.

AS 1099.2EB-1971
$50.39